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Chapter 01
Page 7
Available IC Packages for Atmega328P
Atmega328P is available in different shapes and sizes. A few features also varry with the package.
28pin PDIP (Dual In-line Package) (Most commonly used by STUDENTS/developers)
32pin QFP ( Quad Flat Pack )
28pin MLF (Micro Leadframe Package)
32pin MLF
Notes:
- TQFP
- A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low profile QFP and thin QFP
- PDIP
- In microelectronics, a dual in-line package (DIP or DIL) is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket.
- MLF
- Flat no-leads packages such as QFN (quad-flat no-leads) and DFN (dual-flat no-leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as MicroLeadFrame and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes.
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